High resolution sputter coater
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Chamber size
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150mm Ø (5.9")
Variable height, 165mm - 250mm (6.5" - 9.8")
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Sputter head
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Low voltage planar magnatron
Quick target change
Wrap-around dark-space shield
Shutter for target conditioning
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Sputter target
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Cr, Pt/Pd as standard
(Ta, Au, Au/Pd, Pt or W optional)
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Sputter supply
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Microprocessor based
Safety interlocked
Current control independent of vacuum
Digitally selectable current (20, 40, 60 or 80mA)
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Sample stage
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Non-repetitive rotary planetary motion with manual tilt 0 - 90°
Variable speed rotation
Crystal head
4 sample holders
(click to view photo)
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Analogue metering
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Vacuum, Atm - 0.001mb
Current, 0 - 100mA
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Control method
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Automatic operation of gas purge and leak functions
Automatic process sequencing
Full manual override
Digital timer, 5 - 300 seconds with pause
Automatic vent
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Thickness control
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MTM-20 with termination facility
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Pumping system
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Configuration
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Turbo-drag/rotary pump combination
Optional diaphragm pump instead of rotary pump
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Pumping speed
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300 litres/min @ 0.1mb
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Pumpdown time
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1 min. to 1x10-3mb
(1.5 min. with diaphragm pump option)
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Ultimate pressure
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1x10-5mb
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Desktop system
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Rotary pump is mounted on desktop compatible anti-vibration table
All metal vacuum coupling system
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Thickness monitor
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MTM-20
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Microprocessor based
4 digit display with push button zero
5 times/sec. display update rate
6 MHz crystal with life-time check
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Thickness range
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0 - 999.9nm
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Resolution
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Better than 0.1nm
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Density range
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0.50 - 30.00gm/cm3
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Tooling factor range
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0.25 - 8.00
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Termination range
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0 - 999.9nm
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Services required
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Supply
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100 - 120 or 200 - 240 VAC, 50/60Hz
(specify on order)
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Power
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550 VA max.
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Argon gas
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Purity, min. 99.9%
Pressure, regulated 7 - 8 psi (0.5 - 0.6 bar)
Hose connection, 6.0mm (¼")
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System dimensions
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Size
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Width 600mm (23.6"), Depth 600mm (23.6"),
Height 450mm (17.7")
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Weight
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40Kg (88.5 lbs)
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